Product Feature
HY 9055 is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures withboth on room temperature and heated temperature. It has the feature of thehigher temperature the faster of the curing time. It can be applied to electroniccomponents for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface withmaterials of PC(Poly-carbonate)、PP、ABS、PVC, etc. and metal materials.

Typical Application

HY9055 could be applied to

-high powered electronics

- DC/DCmodule and circuit board which requires heat dissipation and high temperatureresistance.

-Itcan be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.

Technical Parameters

Features		Part A	Part B
Before Curing	Appearence	Gray Fluid	White Fluid
	Viscosisty（25℃cps）	2500±500	2500±500
Operation features	Mixing Ratio	1：1
	Viscosisty(after mixing) （cps）	2000～3000
	Operating Time（25℃ hr）	120
	Curing time （min，25℃）	480
	Curing time（80℃ hr）	20
After Curing	Hardness（Shore A）	55±5
	Thermal conductivity [W（m·K）]	≥0.8
	Dielectric Strength（KV/mm）	≥25
	Permittivity（1.2MHz）	3.0～3.3
	Volume Resisivity（Ω·cm）	≥1.0×1016
	linear expansibility [m/（m·K）]	≤2.2×10-4
	Fire Resistance	94-V1

(Pls note: theabove data for this product in 25 centigrade, 55 percent humidity conditions, for reference. The accurate data is measured by customers when using.)

TECHNICAL GUIDELINES

1. Plsput part A and part B in separate container and stir evenly before mixing thetwo part together.

2.MixingRatio: part A: part B = 1:1

3. Deaerationthe mixture in vacuum pump under 0.08 MPa for 3-5 minutes.Then the mixturecould be used for pouring.

4.Pls note that the thickness of the silicone affects the curing time. If thesilicone used is a little thick, then the curing time will be a littlelonger.The temperature also affects the curing time.When in lower temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization.With temperature of 80～100 centigrade, the silicone will cure in15 minutes; while in 25 centigrade room temperature, the silicone will curearound 8 hours.

Notes:
1.Thefollowing material may hinder the curing of HY 9055, So pls use after the test.When necessary, pls clean the application areas.

Organotin compound or Condensationsilicone with organotin

Sulphur, sulfide and sulfur rubber materials.

Amine compounds as well as contains theamine materials.

Pewters solder flux

2. HY9055 should be sealed storage.The mixture should be used up disposably to avoidcausing waste.

3. HY9055 belongs to non-dangerous goods, but keep away from mouth and eyes.

4. When it gets stratified after a period of storage, Please mix itevenly before using, which does not affect the performance.

PACKAGE
20Kg/pail as aset (Part A 10Kg + Part B 10Kg)

SHELF LIFE AND TRANSPORTATION

1. Twelve(12) months when stored at 24C in tightly closed original packages.

2. Thiskind of product is non-dangerous product, which could be transported as generalchemicals.

3. Storagebeyond the expired date doesnotnecessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for qualityassurance reasons.

For more information , pls feel free to contact Hugo:

TEL:086-755-89948019

FAX:086-755-89948030

MOBILE:086-15017635728

SKYPE: hugo.chen007

Website:www(dot)szrl(dot)net

E-MAIL:hugochen014(at)gmail(dot)com