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- Electric Machines And Apparatus For Laser Or Other Light Or Photon Beam, Ultrasonic, Electron Beam, Magnetic Pulse Or Plasma Arc Welding; Electric Machines And Apparatus For Hot Spraying Of Metals, Metal Carbides Or Cermets (excl. Metal Spray Guns Specified Elsewhere)
HOT SALE CHINAFIX CF160 infrared BGA soldering sta
Product Images
Product Property
| Maximum Powe : | 2.3KW |
| PCB size : | 405mm*310mm |
| demension : | Lmm360*Wmm520*H430mm |
| Product Status : | New |
| Sample Available : | no |
| Shipment Terms : | Negotiable |
| Payment Mode : |
WesternUnion |
Description
Functional Parameter
CF160Functional Parameter
Basic Standard
Power supply:AC 220V/50-60HZ
Heating Method:Two-side infrared heating
Demension:Lmm360*Wmm520*H430mm
Maximum Power:2.3KW
PCB size:405mm*310mm
Temperature Control Method
Heating controlled independently:Yes
Upper heating control method:High-precision closed-loop control, instrument error is about 0.5%
Upper temperature control and measuring method: High sensitivity temperature sensor, temperature monitoring indirectly.(monitor temperature of heater element)
Bottom heating control method:High-precision closed-loop control, instrument error is about 0.5%
Bottom temperature control and measuring method: High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element)
Rework station Function
Application type:Be suitable for welding, sealing-off or repairing BGA, PBGA, CSP on different PCB and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering.
Suitable chip size:less than 50mm
Other Performances
Standby Protection:Yes
Auxiliary lighting:Yes
Features:
In the continuous exploration and practice, we make clear our R&D policy gradually, and we think that BGA rework machine required by users should equipped with below four characteristics:
1.High success rate: high success rate of welding can reduce user's cost, otherwise low success rate will increase user's loss greatly, which is very important for maintenance industry.
2.High reliability: high reliability is the direct guarantee of high success rate and it can reduce manipulation strength greatly at the same time, users mastered repair equipment characteristic can not to stay by machine during welding, otherwise users will waste a lot of valuable time and it's difficult to guarantee the success rate because of low reliability.
3.Easy to operate: it can make users master of operation method as soon as possible and save operation time directly, thus improving working efficiency.
4.Applicability: due to the type and size of electronic components with BGA packaging technique are various and will be more and more kinds, PCB board's size and quality are different greatly, so the applicability is necessary. If machine's range of application is narrow, then it will be hard to meet the requirements of electronic products rapid development.
