silicone rubber for electronic potting
Product Images
Product Property
low viscosity : | Inherent flame resistance |
Product Status : | New |
Sample Available : | yes |
Shipment Terms : | fob |
Payment Mode : |
T/T,L/C,WesternUnion |
Description
Product Feature of silicone rubber for electronic potting compound HY-9060# is a kind of low viscosity, Inherent flame resistance, two components electronics cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. The flame retardant UL94-V0 level can be achieved. It mainly applied in electronic components surface with materials of PC(Poly-carbonate), PP, ABS, PVC, etc. and metal materials.
Typical Application of silicone rubber for electronic potting compound
HY-9060# is suitable for
- high powered electronics,
- DC/DC module and circuit board which requires heat dissipation and high temperature resistance.
It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc.
Technical Parameters of silicone rubber for electronic potting compound
Features | Part A | Part B | |
Before Curing | Appearence | Gray Fluid | White Fluid |
Viscosisty(25°Ccps) | 3000±500 | 3000±500 | |
Operation features | Mixing Ratio | 1:1 | |
Viscosisty(after mixing) (cps) | 2500~3500 | ||
Operating Time(25°C hr) | 120 | ||
Curing time (min, 25°C) | 480 | ||
Curing time(80°C hr) | 20 | ||
After Curing | Hardness(Shore A) | 60±5 | |
Thermal conductivity [W(m·K)] | ≥0.8 | ||
Dielectric Strength(KV/mm) | ≥25 | ||
Permittivity(1.2MHz) | 3.0~3.3 | ||
Volume Resisivity(Ω·cm) | ≥1.0×1016 | ||
linear expansibility [m/(m·K)] | ≤2.2×10-4 | ||
Fire Resistance | 94-V0 |
(Pls note: the above data for this product in 25 °C temperature, 55 percent humidity conditions, for reference. The accurate data is measured by customers to when using.)
TECHNICAL GUIDELINES of silicone rubber for electronic potting compound
1, Pls put part A and part B in separate container and stir evenly before mixing the two part together.
2, Weight Ratio: part A: part B = 1:1
3, Deaeration the mixture in vacuum pump under 0.08 MPa for 3-5 minutes.
4, The temperature influences the curing time of HY-9060#. When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization. Suggested operation time and temperature. With temperature of 80~100°C, the silicone will cure in 15 minutes, while in 25°C room temperature, the silicone will cure around 8 hours.
Warm Tips of silicone rubber for electronic potting compound
:
1.The following material may hinder the curing of the product, So pls apply after summary experiment. When necessary, pls clean the application areas.
l Condensation silicone which not completely cured or organic tin compounds
l Sulphur, sulfide and sulfur rubber materials.
l Amine compounds as well as contains the amine materials.
l Pewters solder flux.
2. Should be sealed storage.The mixture should be used up at once, avoid causing waste.
3. Silicone belongs to non-dangerous goods, but keep away from mouth and eyes.
4. When it gets stratified after a period of storage, Please mix 9060 evenly before using, it does not affect the performance.
Any questions of silicone rubber for electronic potting , please feel free to contact ms yif :
TEL: 086-755-89948019
FAX: 086-755-89948030
MOBILE:086-15979907468
Website: www(dot)szrl(dot)net
E-MAIL: guyihuide(at)gmail(dot)com