Layer: 12L,

Base Material:FR-4

Board Thickness: 1.6mm, buried and blind via, BGA plug

Final copper: 35um, impedance control

Surface Finish:Immersion Gold, Au:3u” min.

Solder mask: green, silk: white

Profile: Routing + v-cut

E-test: 100% Fixture

Quality report: Final inspection and Microsection, impedance coupon