Layer: 4L

Base Material:FR-4 tg180(ITEQ)

Board Thickness: 1.55mm

Final copper: 35um

Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:10u”

Solder mask: Red

Silkscreen: white

Profile: Routing + stamp holes

E-test: 100% Fixture

Quality report: Solderability test, Final inspection and Microsection